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@ -30,7 +30,7 @@ |
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(setup |
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(setup |
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(stackup |
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(stackup |
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(layer "F.SilkS" (type "Top Silk Screen")) |
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(layer "F.SilkS" (type "Top Silk Screen") (color "White")) |
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(layer "F.Paste" (type "Top Solder Paste")) |
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(layer "F.Paste" (type "Top Solder Paste")) |
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(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01)) |
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(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01)) |
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(layer "F.Cu" (type "copper") (thickness 0.035)) |
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(layer "F.Cu" (type "copper") (thickness 0.035)) |
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@ -38,7 +38,7 @@ |
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(layer "B.Cu" (type "copper") (thickness 0.035)) |
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(layer "B.Cu" (type "copper") (thickness 0.035)) |
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(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01)) |
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(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01)) |
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(layer "B.Paste" (type "Bottom Solder Paste")) |
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(layer "B.Paste" (type "Bottom Solder Paste")) |
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(layer "B.SilkS" (type "Bottom Silk Screen")) |
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(layer "B.SilkS" (type "Bottom Silk Screen") (color "White")) |
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(copper_finish "None") |
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(copper_finish "None") |
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(dielectric_constraints no) |
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(dielectric_constraints no) |
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) |
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) |
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