These objects can now be used in advanced DRC rules and
not just for keeping things out. Also remove the restriction
that at least one of the "basic" keepout rules must be set,
so that these areas can be used for more advanced rules.
CHANGED: Settings are now stored in versioned sub-directories
ADDED: First-run dialog for migrating settings from a previous version
CHANGED: Settings are now stored as JSON files instead of wxConfig-style INI files
CHANGED: Color settings are now all stored in a separate settings file
CHANGED: The symbol editor and footprint editor now have their own settings files
CHANGED: Color settings are no longer exposed through BOARD object
CHANGED: Page layout editor now uses Eeschema's color scheme
Settings are now managed through a central SETTINGS_MANAGER held by PGM_BASE.
Existing settings will be migrated from the wxConfig format on first run of each application.
Per-application settings are now stored in one class for each application.
Not able to draw a keepout-area on bottom or internal layers.
This was due to a behavior specific to the footprint editor,
not disabled in board editor.
Fixes: lp:1852847
https://bugs.launchpad.net/kicad/+bug/1852847
A few files snuck in with CRLF for the line endings. These make it hard
to look at diffs as every line appears to have changed. This commit
makes only line ending changes, so can be ignored
Set the focus to some control in the copper zone, non-copper zone, and
keep out zone dialogs required for the default button action to work
properly. This only seem to affect windows dialogs.
Fixes lp:1818397
https://bugs.launchpad.net/kicad/+bug/1818397
Also includes a bunch of changes to simplifiy the terminology
and unify the copper, non-copper and keepout versions.
Also removes some legacy features:
Removes contol for fill method. If the fill method is currently
segments the dialog will ask if you want to convert to polygons
on OK.
Removes control of boundary resolution. We've done this with trig
since 5.0.
(cherry picked from commit 487aaeb)
- support for background color setting
- removed several global config settings (such as g_Drc_On)
- wrapped most of global config settings in PCB_GENERAL_SETTINGS class
- reorganized PCB general options dialog to clearly mark which options concern only the legacy canvas
- new GAL feature for legacy users: double-click (or E) to change track width available as an option.
Fixes: lp:1530543
* https://bugs.launchpad.net/kicad/+bug/1530543
Fixes: lp:1707145
* https://bugs.launchpad.net/kicad/+bug/1707145
Removes the need of using the legacy code in polygon/PolyLine.{h,cpp},
refactoring all CPolyLine instances with SHAPE_POLY_SET instances.
The remaining legacy methods have been ported to SHAPE_POLY_SET;
mainly: Chamfer, Fillet, {,Un}Hatch.
The iteration over the polygon vertices have been simplified using the
family of ITERATOR classes.
eeschema now supports arbitrary colors for all object types, and
pcbnew does in GAL canvas. When switching from GAL to legacy canvas,
pcbnew will convert colors to the nearest legacy color.
* UI capitalization policy fixes.
* Set OK button as the default.
* Use default dialog size to allow sizers to do their job.
* Minor grammar and abbreviation string fixes.
2) Change from legacy Cu stack to counting down from top=(F_Cu or 0).
The old Cu stack required knowing the count of Cu layers to make
sense of the layer number when converting to many exported file types.
The new Cu stack is more commonly used, although ours still gives
B_Cu a fixed number.
3) Introduce class LSET and enum LAYER_ID.
4) Change *.kicad_pcb file format version to 4 from 3.
5) Change fixed names Inner1_Cu-Inner14_Cu to In1_Cu-In30_Cu and their
meanings are typically flipped.
6) Moved the #define LAYER_N_* stuff into legacy_plugin.cpp where they
can die a quiet death, and switch to enum LAYER_ID symbols throughout.
7) Removed the LEGACY_PLUGIN::Save() and FootprintSave() functions.
You will need to convert to the format immediately, *.kicad_pcb and
*.kicad_mod (=pretty) since legacy format was never going to know
about 32 Cu layers and additional technical layers and the reversed Cu
stack.
Jeff Young
Marek Roszko
jean-pierre charras
Wayne Stambaugh
Jon Evans
Seth Hillbrand
Oliver Walters
Tomasz Włostowski
Alejandro García Montoro
Wayne Stambaugh
Dick Hollenbeck