Recommendation is to avoid using the year nomenclature as this
information is already encoded in the git repo. Avoids needing to
repeatly update.
Also updates AUTHORS.txt from current repo with contributor names
- "Fill all vias" option disables the cut in copper layers which is
important to speed up EM simulations.
- "Cut vias in board body" enables cutting even if copper layer export
is disabled, which is useful if you're using vias as mounting holes.
Related: https://gitlab.com/kicad/code/kicad/-/issues/18735
CHANGED: PCB file format now supports saving/loading complex padstacks
CHANGED: PTH pads are now rendered per copper layer in the copper color;
the PTH pad color is no longer used.
ADDED: support for importing complex pad stacks from Altium PCBs
Enforce padstack-aware access to pad properties across KiCad
Fixes https://gitlab.com/kicad/code/kicad/-/issues/8182
* do not try to load vrml files for file formats that do not use them
* more tolerant test for step file: search header using up to 3 first lines
instead of only the first line
* dialog export: ensure the file ext is synchronized with the file format
the first time the dialog is opened
* more info messages: now a message is printed if the actual file format of
a 3D file is not recognized
Schematics, symbols, boards and footprints all get the ability to store
files inside their file structures. File lookups now have a
kicad-embed:// URI to allow various parts of KiCad to refer to files
stored in this manner.
kicad-embed://datasheet.pdf references the file named "datasheet.pdf"
embedded in the document. Embeds are allowed in schematics, boards,
symbols and footprints. Currently supported embeddings are Datasheets,
3D Models and drawingsheets
Fixes https://gitlab.com/kicad/code/kicad/-/issues/6918
Fixes https://gitlab.com/kicad/code/kicad/-/issues/2376
Fixes https://gitlab.com/kicad/code/kicad/-/issues/17827
- Option to export pads separately from tracks+vias
- Options export silkscreen and soldermask as flat faces
- Improve 3D model export dialog layout
- Use VisMaterialTool to specify metallic-roughness for glTF.
- Less OCCT boolean operations (faster, less bugs)
Fixes https://gitlab.com/kicad/code/kicad/-/issues/2072
* Add compare method to COLOR4D object.
* Add unit test to validate COLOR4D comparison method.
* Add missing color test in text attribute comparison method.
* Add unit test for text attribute object.
* Remove unnecessary headers from text attribute header.
* Move text attribute code into separate source file.
- fix duplicate code and a few bugs (some are due to changes in code over the years)
- ADDED: option to export tracks and vias on external layers Exporting tracks is *very* time consuming,
and need a bit of optimization.
A dielectric layer (between 2 copper layers) can be made by more than one
layer (composite dielectric). Not frequent, but possible.
sub-layers where previously ignored.
Seth Hillbrand
jean-pierre charras
Alex Shvartzkop
Jan Wichmann
Jon Evans
Marek Roszko
Jeff Young
Mike Williams
Wayne Stambaugh