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@ -145,7 +145,7 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run() |
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{ |
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PAD* pad = static_cast<PAD*>( item ); |
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// We only care about drilled (ie: round) holes
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// Slots are generally milled _after_ drilling, so we ignore them.
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if( pad->GetDrillSize().x && pad->GetDrillSize().x == pad->GetDrillSize().y ) |
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m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance ); |
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} |
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@ -153,9 +153,9 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run() |
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{ |
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PCB_VIA* via = static_cast<PCB_VIA*>( item ); |
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// We only care about mechanically drilled (ie: non-laser) holes
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if( via->GetViaType() == VIATYPE::THROUGH ) |
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m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance ); |
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// Blind/buried/microvias will be drilled/burned _prior_ to lamination, so
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// subsequently drilled holes need to avoid them.
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m_holeTree.Insert( item, Edge_Cuts, m_largestHoleToHoleClearance ); |
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} |
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return true; |
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@ -173,8 +173,10 @@ bool DRC_TEST_PROVIDER_HOLE_TO_HOLE::Run() |
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if( !reportProgress( ii++, count, progressDelta ) ) |
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return false; // DRC cancelled
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// We only care about mechanically drilled (ie: non-laser) holes
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if( via->GetViaType() == VIATYPE::THROUGH ) |
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// We only care about mechanically drilled (ie: non-laser) holes. These include both
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// blind/buried via holes (drilled prior to lamination) and through-via and drilled pad
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// holes (which are generally drilled post laminataion).
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if( via->GetViaType() != VIATYPE::MICROVIA ) |
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{ |
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std::shared_ptr<SHAPE_CIRCLE> holeShape = getDrilledHoleShape( via ); |
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