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ADDED: separate front/back silk and mask colours for STEP export. 

Fixes https://gitlab.com/kicad/code/kicad/-/issues/21593

(cherry picked from commit acc7b1e508)
9.0
Jeff Young 1 month ago
parent
1e3b879d93
commit
54e9a97b26
2 changed files with 38 additions and 22 deletions
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  1. 54
      pcbnew/exporters/step/step_pcb_model.cpp
  2. 6
      pcbnew/exporters/step/step_pcb_model.h

54
pcbnew/exporters/step/step_pcb_model.cpp
View File

@ -1178,12 +1178,20 @@ bool STEP_PCB_MODEL::AddPolygonShapes( const SHAPE_POLY_SET* aPolyShapes, PCB_LA
double z_pos, thickness;
getLayerZPlacement( aLayer, z_pos, thickness );
std::vector<TopoDS_Shape>& targetVec = IsCopperLayer( aLayer ) ? m_board_copper[aNetname]
: aLayer == F_SilkS || aLayer == B_SilkS
? m_board_silkscreen
: m_board_soldermask;
std::vector<TopoDS_Shape>* targetVec = nullptr;
if( !MakeShapes( targetVec, *aPolyShapes, m_simplifyShapes, thickness, z_pos, aOrigin ) )
if( IsCopperLayer( aLayer ) )
targetVec = &m_board_copper[aNetname];
else if( aLayer == F_SilkS )
targetVec = &m_board_front_silk;
else if( aLayer == B_SilkS )
targetVec = &m_board_back_silk;
else if( aLayer == F_Mask )
targetVec = &m_board_front_mask;
else
targetVec = &m_board_back_mask;
if( !MakeShapes( *targetVec, *aPolyShapes, m_simplifyShapes, thickness, z_pos, aOrigin ) )
{
m_reporter->Report( wxString::Format( _( "Could not add shape (%d points) to copper layer %s." ),
aPolyShapes->FullPointCount(),
@ -2271,8 +2279,10 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool
Quantity_ColorRGBA pad_color( m_padColor[0], m_padColor[1], m_padColor[2], 1.0 );
Quantity_ColorRGBA board_color( 0.3f, 0.3f, 0.3f, 1.0f );
Quantity_ColorRGBA silk_color( 1.0f, 1.0f, 1.0f, 0.9f );
Quantity_ColorRGBA mask_color( 0.08f, 0.2f, 0.14f, 0.83f );
Quantity_ColorRGBA front_silk_color( 1.0f, 1.0f, 1.0f, 0.9f );
Quantity_ColorRGBA back_silk_color = front_silk_color;
Quantity_ColorRGBA front_mask_color( 0.08f, 0.2f, 0.14f, 0.83f );
Quantity_ColorRGBA back_mask_color = front_mask_color;
// Get colors from stackup
for( const BOARD_STACKUP_ITEM* item : m_stackup.GetList() )
@ -2285,24 +2295,26 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool
if( item->GetBrdLayerId() == F_Mask || item->GetBrdLayerId() == B_Mask )
{
col.Darken( 0.2 );
mask_color.SetValues( col.r, col.g, col.b, col.a );
if( item->GetBrdLayerId() == F_Mask )
front_mask_color.SetValues( col.r, col.g, col.b, col.a );
else
back_mask_color.SetValues( col.r, col.g, col.b, col.a );
}
if( item->GetBrdLayerId() == F_SilkS || item->GetBrdLayerId() == B_SilkS )
silk_color.SetValues( col.r, col.g, col.b, col.a );
if( item->GetBrdLayerId() == F_SilkS )
front_silk_color.SetValues( col.r, col.g, col.b, col.a );
else if( item->GetBrdLayerId() == B_SilkS )
back_silk_color.SetValues( col.r, col.g, col.b, col.a );
if( item->GetType() == BS_ITEM_TYPE_DIELECTRIC && item->GetTypeName() == KEY_CORE )
board_color.SetValues( col.r, col.g, col.b, col.a );
}
if( !m_enabledLayers.Contains( F_Mask ) && !m_enabledLayers.Contains( B_Mask ) )
{
board_color = mask_color;
board_color.SetAlpha( 1.0 );
}
TDF_Label mask_mat = makeMaterial( "soldermask", mask_color, 0.0, 0.6 );
TDF_Label silk_mat = makeMaterial( "silkscreen", silk_color, 0.0, 0.9 );
TDF_Label front_mask_mat = makeMaterial( "soldermask", front_mask_color, 0.0, 0.6 );
TDF_Label back_mask_mat = makeMaterial( "soldermask", back_mask_color, 0.0, 0.6 );
TDF_Label front_silk_mat = makeMaterial( "silkscreen", front_silk_color, 0.0, 0.9 );
TDF_Label back_silk_mat = makeMaterial( "silkscreen", back_silk_color, 0.0, 0.9 );
TDF_Label copper_mat = makeMaterial( "copper", copper_color, 1.0, 0.4 );
TDF_Label pad_mat = makeMaterial( "pad", pad_color, 1.0, 0.4 );
TDF_Label board_mat = makeMaterial( "board", board_color, 0.0, 0.8 );
@ -2311,8 +2323,10 @@ bool STEP_PCB_MODEL::CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool
pushToAssemblyMap( m_board_copper_pads, pad_mat, "pad", true, true );
pushToAssemblyMap( m_board_copper_vias, copper_mat, "via", true, true );
pushToAssemblyMap( m_board_copper_fused, copper_mat, "copper", true, true );
pushToAssembly( m_board_silkscreen, silk_mat, "silkscreen", true );
pushToAssembly( m_board_soldermask, mask_mat, "soldermask", true );
pushToAssembly( m_board_front_silk, front_silk_mat, "silkscreen", true );
pushToAssembly( m_board_back_silk, back_silk_mat, "silkscreen", true );
pushToAssembly( m_board_front_mask, front_mask_mat, "soldermask", true );
pushToAssembly( m_board_back_mask, back_mask_mat, "soldermask", true );
if( aPushBoardBody )
pushToAssembly( m_board_outlines, board_mat, "PCB", false );

6
pcbnew/exporters/step/step_pcb_model.h
View File

@ -292,8 +292,10 @@ private:
std::map<wxString, std::vector<TopoDS_Shape>> m_board_copper_fused;
// Graphical items
std::vector<TopoDS_Shape> m_board_silkscreen;
std::vector<TopoDS_Shape> m_board_soldermask;
std::vector<TopoDS_Shape> m_board_front_silk;
std::vector<TopoDS_Shape> m_board_back_silk;
std::vector<TopoDS_Shape> m_board_front_mask;
std::vector<TopoDS_Shape> m_board_back_mask;
// Data for pads. Key example: Pad_F_U2_1_GND
std::map<wxString, std::vector<std::pair<gp_Pnt, TopoDS_Shape>>> m_pad_points;

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