From 441032d914418d9b6397c4b6a99a98cac2ff7fb8 Mon Sep 17 00:00:00 2001 From: CloverGit Date: Tue, 19 Aug 2025 05:32:10 +0200 Subject: [PATCH] Translated using Weblate (Chinese (Simplified Han script)) Currently translated at 96.9% (10164 of 10488 strings) Translation: KiCad EDA/master source Translate-URL: https://hosted.weblate.org/projects/kicad/master-source/zh_Hans/ --- translation/pofiles/zh_CN.po | 14 +++++++------- 1 file changed, 7 insertions(+), 7 deletions(-) diff --git a/translation/pofiles/zh_CN.po b/translation/pofiles/zh_CN.po index c21aacac3e..0710058144 100644 --- a/translation/pofiles/zh_CN.po +++ b/translation/pofiles/zh_CN.po @@ -42,7 +42,7 @@ msgstr "" "Project-Id-Version: KiCad_zh_CN_Master_v0.0.32\n" "Report-Msgid-Bugs-To: \n" "POT-Creation-Date: 2025-08-17 01:15+0300\n" -"PO-Revision-Date: 2025-08-18 07:02+0000\n" +"PO-Revision-Date: 2025-08-19 08:02+0000\n" "Last-Translator: CloverGit \n" "Language-Team: Chinese (Simplified Han script) \n" @@ -40176,7 +40176,7 @@ msgstr "电路板上, 非铜层" #: pcbnew/dialogs/panel_setup_layers.cpp:188 msgid "If you want a solder paste layer for front side of the board" -msgstr "如果您希望在电路板正面使用焊膏层" +msgstr "如果您希望在电路板正面使用锡膏层" #: pcbnew/dialogs/panel_setup_layers.cpp:206 msgid "If you want a silk screen layer for the front side of the board" @@ -45515,7 +45515,7 @@ msgstr "(贴片焊盘在电路板的不同面上分别有铜层和阻焊层)" #: pcbnew/pad.cpp:2356 pcbnew/pad.cpp:2369 msgid "(SMD pad has copper and paste layers on different sides of the board)" -msgstr "(贴片焊盘的铜层和焊膏层分别处在电路板的不同面上)" +msgstr "(贴片焊盘的铜层和锡膏层分别处在电路板的不同面上)" #: pcbnew/pad.cpp:2375 msgid "(SMD pad has no outer layers)" @@ -45544,25 +45544,25 @@ msgstr "(焊盘孔不在焊盘形状内)" #: pcbnew/pad.cpp:2450 msgid "(negative local clearance values have no effect)" -msgstr "(负局部间距值无效)" +msgstr "(负的局部间距值无效)" #: pcbnew/pad.cpp:2469 msgid "" "(negative solder mask clearance is larger than some shape primitives; " "results may be surprising)" -msgstr "(负阻焊间距大于某些形状原型; 可能产生意料之外的结果)" +msgstr "(负的阻焊间距大于某些形状原型; 可能产生意料之外的结果)" #: pcbnew/pad.cpp:2479 msgid "" "(negative solder mask clearance is larger than pad; no solder mask will be " "generated)" -msgstr "(负阻焊间距大于焊盘; 不会生成阻焊层)" +msgstr "(负的阻焊间距大于焊盘; 不会生成阻焊层)" #: pcbnew/pad.cpp:2498 msgid "" "(negative solder paste margin is larger than pad; no solder paste mask will " "be generated)" -msgstr "(负焊膏余量大于焊盘; 不会生成锡膏层)" +msgstr "(锡膏的内缩量超过焊盘尺寸, 不会生成该焊盘的锡膏层)" #: pcbnew/pad.cpp:2505 msgid "(negative corner radius is not allowed)"