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@ -374,6 +374,8 @@ void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningR |
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if( !m_board || !m_board->IsFootprintHolder() ) |
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m_biuTo3Dunits *= 1.6f; |
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ReloadColorSettings(); |
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m_boardBodyThickness3DU = DEFAULT_BOARD_THICKNESS * m_biuTo3Dunits; |
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m_frontCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; |
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m_backCopperThickness3DU = DEFAULT_COPPER_THICKNESS * m_biuTo3Dunits; |
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@ -467,7 +469,19 @@ void BOARD_ADAPTER::InitSettings( REPORTER* aStatusReporter, REPORTER* aWarningR |
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const float zpos_copperTop_back = m_layerZcoordTop[B_Cu]; |
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const float zpos_copperTop_front = m_layerZcoordTop[F_Cu]; |
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// calculate z position for each non copper layer
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// Fill not copper layers zpos with a dummy position
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// (m_layerZcoordTop[B_Cu]with a small margin)
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// Some important layer position will be set later
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for( int layer_id = 0; layer_id < PCB_LAYER_ID_COUNT; layer_id++ ) |
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{ |
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if( IsCopperLayer( (PCB_LAYER_ID)layer_id ) ) |
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continue; |
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m_layerZcoordBottom[(PCB_LAYER_ID)layer_id] = zpos_copperTop_back - 2.0f * zpos_offset; |
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m_layerZcoordTop[(PCB_LAYER_ID)layer_id] = m_layerZcoordBottom[(PCB_LAYER_ID)layer_id] - m_backCopperThickness3DU; |
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} |
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// calculate z position for each technical layer
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// Solder mask and Solder paste have the same Z position
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for( PCB_LAYER_ID layer_id : { B_Adhes, B_Mask, B_Paste, F_Adhes, F_Mask, F_Paste, B_SilkS, F_SilkS } ) |
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{ |
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