|
|
/*
* This program source code file is part of KiCad, a free EDA CAD application. * * Copyright (C) 2015-2016 Mario Luzeiro <mrluzeiro@ua.pt> * Copyright (C) 1992-2021 KiCad Developers, see AUTHORS.txt for contributors. * * This program is free software; you can redistribute it and/or * modify it under the terms of the GNU General Public License * as published by the Free Software Foundation; either version 2 * of the License, or (at your option) any later version. * * This program is distributed in the hope that it will be useful, * but WITHOUT ANY WARRANTY; without even the implied warranty of * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the * GNU General Public License for more details. * * You should have received a copy of the GNU General Public License * along with this program; if not, you may find one here: * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
* or you may search the http://www.gnu.org website for the version 2 license,
* or you may write to the Free Software Foundation, Inc., * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA */
/**
* @file create_layer_items.cpp * @brief This file implements the creation of the pcb board. * * It is based on the function found in the files: * board_items_to_polygon_shape_transform.cpp * board_items_to_polygon_shape_transform.cpp */
#include "board_adapter.h"
#include "../3d_rendering/raytracing/shapes2D/filled_circle_2d.h"
#include <board_design_settings.h>
#include <footprint.h>
#include <pad.h>
#include <pcb_text.h>
#include <fp_shape.h>
#include <zone.h>
#include <convert_basic_shapes_to_polygon.h>
#include <trigo.h>
#include <vector>
#include <thread>
#include <core/arraydim.h>
#include <algorithm>
#include <atomic>
#include <wx/log.h>
#ifdef PRINT_STATISTICS_3D_VIEWER
#include <profile.h>
#endif
void BOARD_ADAPTER::destroyLayers(){ if( !m_layers_poly.empty() ) { for( auto& poly : m_layers_poly ) delete poly.second;
m_layers_poly.clear(); }
delete m_frontPlatedPadPolys; m_frontPlatedPadPolys = nullptr;
delete m_backPlatedPadPolys; m_backPlatedPadPolys = nullptr;
if( !m_layerHoleIdPolys.empty() ) { for( auto& poly : m_layerHoleIdPolys ) delete poly.second;
m_layerHoleIdPolys.clear(); }
if( !m_layerHoleOdPolys.empty() ) { for( auto& poly : m_layerHoleOdPolys ) delete poly.second;
m_layerHoleOdPolys.clear(); }
if( !m_layerMap.empty() ) { for( auto& poly : m_layerMap ) delete poly.second;
m_layerMap.clear(); }
delete m_platedPadsFront; m_platedPadsFront = nullptr;
delete m_platedPadsBack; m_platedPadsBack = nullptr;
if( !m_layerHoleMap.empty() ) { for( auto& poly : m_layerHoleMap ) delete poly.second;
m_layerHoleMap.clear(); }
m_throughHoleIds.Clear(); m_throughHoleOds.Clear(); m_throughHoleAnnularRings.Clear(); m_throughHoleViaOds.Clear(); m_throughHoleViaIds.Clear(); m_nonPlatedThroughHoleOdPolys.RemoveAllContours(); m_throughHoleOdPolys.RemoveAllContours();
m_throughHoleViaOdPolys.RemoveAllContours(); m_throughHoleAnnularRingPolys.RemoveAllContours();}
void BOARD_ADAPTER::createLayers( REPORTER* aStatusReporter ){ destroyLayers();
// Build Copper layers
// Based on:
// https://github.com/KiCad/kicad-source-mirror/blob/master/3d-viewer/3d_draw.cpp#L692
#ifdef PRINT_STATISTICS_3D_VIEWER
unsigned stats_startCopperLayersTime = GetRunningMicroSecs();
unsigned start_Time = stats_startCopperLayersTime;#endif
PCB_LAYER_ID cu_seq[MAX_CU_LAYERS]; LSET cu_set = LSET::AllCuMask( m_copperLayersCount );
m_trackCount = 0; m_averageTrackWidth = 0; m_viaCount = 0; m_averageViaHoleDiameter = 0; m_holeCount = 0; m_averageHoleDiameter = 0;
if( !m_board ) return;
// Prepare track list, convert in a vector. Calc statistic for the holes
std::vector<const PCB_TRACK*> trackList; trackList.clear(); trackList.reserve( m_board->Tracks().size() );
for( PCB_TRACK* track : m_board->Tracks() ) { if( !Is3dLayerEnabled( track->GetLayer() ) ) // Skip non enabled layers
continue;
// Note: a PCB_TRACK holds normal segment tracks and also vias circles (that have also
// drill values)
trackList.push_back( track );
if( track->Type() == PCB_VIA_T ) { const PCB_VIA *via = static_cast< const PCB_VIA*>( track ); m_viaCount++; m_averageViaHoleDiameter += via->GetDrillValue() * m_biuTo3Dunits; } else { m_trackCount++; }
m_averageTrackWidth += track->GetWidth() * m_biuTo3Dunits; }
if( m_trackCount ) m_averageTrackWidth /= (float)m_trackCount;
if( m_viaCount ) m_averageViaHoleDiameter /= (float)m_viaCount;
// Prepare copper layers index and containers
std::vector< PCB_LAYER_ID > layer_id; layer_id.clear(); layer_id.reserve( m_copperLayersCount );
for( unsigned i = 0; i < arrayDim( cu_seq ); ++i ) cu_seq[i] = ToLAYER_ID( B_Cu - i );
for( LSEQ cu = cu_set.Seq( cu_seq, arrayDim( cu_seq ) ); cu; ++cu ) { const PCB_LAYER_ID curr_layer_id = *cu;
if( !Is3dLayerEnabled( curr_layer_id ) ) // Skip non enabled layers
continue;
layer_id.push_back( curr_layer_id );
BVH_CONTAINER_2D *layerContainer = new BVH_CONTAINER_2D; m_layerMap[curr_layer_id] = layerContainer;
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL ) { SHAPE_POLY_SET* layerPoly = new SHAPE_POLY_SET; m_layers_poly[curr_layer_id] = layerPoly; } }
if( m_Cfg->m_Render.renderPlatedPadsAsPlated && m_Cfg->m_Render.realistic ) { m_frontPlatedPadPolys = new SHAPE_POLY_SET; m_backPlatedPadPolys = new SHAPE_POLY_SET;
m_platedPadsFront = new BVH_CONTAINER_2D; m_platedPadsBack = new BVH_CONTAINER_2D;
}
if( aStatusReporter ) aStatusReporter->Report( _( "Create tracks and vias" ) );
// Create tracks as objects and add it to container
for( PCB_LAYER_ID curr_layer_id : layer_id ) { wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// Add track segments shapes and via annulus shapes
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx ) { const PCB_TRACK *track = trackList[trackIdx];
// NOTE: Vias can be on multiple layers
if( !track->IsOnLayer( curr_layer_id ) ) continue;
// Skip vias annulus when not connected on this layer (if removing is enabled)
const PCB_VIA *via = dyn_cast< const PCB_VIA*>( track );
if( via && !via->FlashLayer( curr_layer_id ) && IsCopperLayer( curr_layer_id ) ) continue;
// Add object item to layer container
createTrack( track, layerContainer, 0.0f ); } }
// Create VIAS and THTs objects and add it to holes containers
for( PCB_LAYER_ID curr_layer_id : layer_id ) { // ADD TRACKS
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx ) { const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) ) continue;
// ADD VIAS and THT
if( track->Type() == PCB_VIA_T ) { const PCB_VIA* via = static_cast<const PCB_VIA*>( track ); const VIATYPE viatype = via->GetViaType(); const float holediameter = via->GetDrillValue() * BiuTo3dUnits();
// holes and layer copper extend half info cylinder wall to hide transition
const float thickness = GetHolePlatingThickness() * BiuTo3dUnits() / 2.0f; const float hole_inner_radius = holediameter / 2.0f; const float ring_radius = via->GetWidth() * BiuTo3dUnits() / 2.0f;
const SFVEC2F via_center( via->GetStart().x * m_biuTo3Dunits, -via->GetStart().y * m_biuTo3Dunits );
if( viatype != VIATYPE::THROUGH ) {
// Add hole objects
BVH_CONTAINER_2D *layerHoleContainer = nullptr;
// Check if the layer is already created
if( m_layerHoleMap.find( curr_layer_id ) == m_layerHoleMap.end() ) { // not found, create a new container
layerHoleContainer = new BVH_CONTAINER_2D; m_layerHoleMap[curr_layer_id] = layerHoleContainer; } else { // found
layerHoleContainer = m_layerHoleMap[curr_layer_id]; }
// Add a hole for this layer
layerHoleContainer->Add( new FILLED_CIRCLE_2D( via_center, hole_inner_radius + thickness, *track ) ); } else if( curr_layer_id == layer_id[0] ) // it only adds once the THT holes
{ // Add through hole object
m_throughHoleOds.Add( new FILLED_CIRCLE_2D( via_center, hole_inner_radius + thickness, *track ) ); m_throughHoleViaOds.Add( new FILLED_CIRCLE_2D( via_center, hole_inner_radius + thickness, *track ) );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic ) { m_throughHoleAnnularRings.Add( new FILLED_CIRCLE_2D( via_center, ring_radius, *track ) ); }
m_throughHoleIds.Add( new FILLED_CIRCLE_2D( via_center, hole_inner_radius, *track ) ); } } } }
// Create VIAS and THTs objects and add it to holes containers
for( PCB_LAYER_ID curr_layer_id : layer_id ) { // ADD TRACKS
const unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx ) { const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) ) continue;
// ADD VIAS and THT
if( track->Type() == PCB_VIA_T ) { const PCB_VIA* via = static_cast<const PCB_VIA*>( track ); const VIATYPE viatype = via->GetViaType();
if( viatype != VIATYPE::THROUGH ) { // Add PCB_VIA hole contours
// Add outer holes of VIAs
SHAPE_POLY_SET *layerOuterHolesPoly = nullptr; SHAPE_POLY_SET *layerInnerHolesPoly = nullptr;
// Check if the layer is already created
if( m_layerHoleOdPolys.find( curr_layer_id ) == m_layerHoleOdPolys.end() ) { // not found, create a new container
layerOuterHolesPoly = new SHAPE_POLY_SET; m_layerHoleOdPolys[curr_layer_id] = layerOuterHolesPoly;
wxASSERT( m_layerHoleIdPolys.find( curr_layer_id ) == m_layerHoleIdPolys.end() );
layerInnerHolesPoly = new SHAPE_POLY_SET; m_layerHoleIdPolys[curr_layer_id] = layerInnerHolesPoly; } else { // found
layerOuterHolesPoly = m_layerHoleOdPolys[curr_layer_id];
wxASSERT( m_layerHoleIdPolys.find( curr_layer_id ) != m_layerHoleIdPolys.end() );
layerInnerHolesPoly = m_layerHoleIdPolys[curr_layer_id]; }
const int holediameter = via->GetDrillValue(); const int hole_outer_radius = (holediameter / 2) + GetHolePlatingThickness();
TransformCircleToPolygon( *layerOuterHolesPoly, via->GetStart(), hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
TransformCircleToPolygon( *layerInnerHolesPoly, via->GetStart(), holediameter / 2, ARC_HIGH_DEF, ERROR_INSIDE ); } else if( curr_layer_id == layer_id[0] ) // it only adds once the THT holes
{ const int holediameter = via->GetDrillValue(); const int hole_outer_radius = (holediameter / 2) + GetHolePlatingThickness(); const int hole_outer_ring_radius = via->GetWidth() / 2.0f;
// Add through hole contours
TransformCircleToPolygon( m_throughHoleOdPolys, via->GetStart(), hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
// Add same thing for vias only
TransformCircleToPolygon( m_throughHoleViaOdPolys, via->GetStart(), hole_outer_radius, ARC_HIGH_DEF, ERROR_INSIDE );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic ) { TransformCircleToPolygon( m_throughHoleAnnularRingPolys, via->GetStart(), hole_outer_ring_radius, ARC_HIGH_DEF, ERROR_INSIDE ); } } } } }
// Creates vertical outline contours of the tracks and add it to the poly of the layer
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL ) { for( PCB_LAYER_ID curr_layer_id : layer_id ) { wxASSERT( m_layers_poly.find( curr_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[curr_layer_id];
// ADD TRACKS
unsigned int nTracks = trackList.size();
for( unsigned int trackIdx = 0; trackIdx < nTracks; ++trackIdx ) { const PCB_TRACK *track = trackList[trackIdx];
if( !track->IsOnLayer( curr_layer_id ) ) continue;
// Skip vias annulus when not connected on this layer (if removing is enabled)
const PCB_VIA *via = dyn_cast<const PCB_VIA*>( track );
if( via && !via->FlashLayer( curr_layer_id ) && IsCopperLayer( curr_layer_id ) ) continue;
// Add the track/via contour
track->TransformShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); } } }
// Add holes of footprints
for( FOOTPRINT* footprint : m_board->Footprints() ) { for( PAD* pad : footprint->Pads() ) { const wxSize padHole = pad->GetDrillSize();
if( !padHole.x ) // Not drilled pad like SMD pad
continue;
// The hole in the body is inflated by copper thickness, if not plated, no copper
const int inflate = ( pad->GetAttribute () != PAD_ATTRIB::NPTH ) ? GetHolePlatingThickness() / 2 : 0;
m_holeCount++; m_averageHoleDiameter += ( ( pad->GetDrillSize().x + pad->GetDrillSize().y ) / 2.0f ) * m_biuTo3Dunits;
m_throughHoleOds.Add( createPadWithDrill( pad, inflate ) );
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic ) m_throughHoleAnnularRings.Add( createPadWithDrill( pad, inflate ) );
m_throughHoleIds.Add( createPadWithDrill( pad, 0 ) ); } }
if( m_holeCount ) m_averageHoleDiameter /= (float)m_holeCount;
// Add contours of the pad holes (pads can be Circle or Segment holes)
for( FOOTPRINT* footprint : m_board->Footprints() ) { for( PAD* pad : footprint->Pads() ) { const wxSize padHole = pad->GetDrillSize();
if( !padHole.x ) // Not drilled pad like SMD pad
continue;
// The hole in the body is inflated by copper thickness.
const int inflate = GetHolePlatingThickness();
if( pad->GetAttribute () != PAD_ATTRIB::NPTH ) { if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic ) { pad->TransformHoleWithClearanceToPolygon( m_throughHoleAnnularRingPolys, inflate, ARC_HIGH_DEF, ERROR_INSIDE ); }
pad->TransformHoleWithClearanceToPolygon( m_throughHoleOdPolys, inflate, ARC_HIGH_DEF, ERROR_INSIDE ); } else { // If not plated, no copper.
if( m_Cfg->m_Render.clip_silk_on_via_annulus && m_Cfg->m_Render.realistic ) { pad->TransformHoleWithClearanceToPolygon( m_throughHoleAnnularRingPolys, 0, ARC_HIGH_DEF, ERROR_INSIDE ); }
pad->TransformHoleWithClearanceToPolygon( m_nonPlatedThroughHoleOdPolys, 0, ARC_HIGH_DEF, ERROR_INSIDE ); } } }
const bool renderPlatedPadsAsPlated = m_Cfg->m_Render.renderPlatedPadsAsPlated && m_Cfg->m_Render.realistic;
// Add footprints PADs objects to containers
for( PCB_LAYER_ID curr_layer_id : layer_id ) { wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// ADD PADS
for( FOOTPRINT* footprint : m_board->Footprints() ) { // Note: NPTH pads are not drawn on copper layers when the pad has the same shape
// as its hole
addPadsWithClearance( footprint, layerContainer, curr_layer_id, 0, true, renderPlatedPadsAsPlated, false );
// Micro-wave footprints may have items on copper layers
addFootprintShapesWithClearance( footprint, layerContainer, curr_layer_id, 0 ); } }
if( renderPlatedPadsAsPlated ) { // ADD PLATED PADS
for( FOOTPRINT* footprint : m_board->Footprints() ) { addPadsWithClearance( footprint, m_platedPadsFront, F_Cu, 0, true, false, true );
addPadsWithClearance( footprint, m_platedPadsBack, B_Cu, 0, true, false, true ); }
m_platedPadsFront->BuildBVH(); m_platedPadsBack->BuildBVH(); }
// Add footprints PADs poly contours (vertical outlines)
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL ) { for( PCB_LAYER_ID curr_layer_id : layer_id ) { wxASSERT( m_layers_poly.find( curr_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[curr_layer_id];
// Add pads to polygon list
for( FOOTPRINT* footprint : m_board->Footprints() ) { // Note: NPTH pads are not drawn on copper layers when the pad
// has same shape as its hole
footprint->TransformPadsWithClearanceToPolygon( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE, true, renderPlatedPadsAsPlated, false );
transformFPShapesToPolygon( footprint, curr_layer_id, *layerPoly ); } }
if( renderPlatedPadsAsPlated ) { // ADD PLATED PADS contours
for( FOOTPRINT* footprint : m_board->Footprints() ) { footprint->TransformPadsWithClearanceToPolygon( *m_frontPlatedPadPolys, F_Cu, 0, ARC_HIGH_DEF, ERROR_INSIDE, true, false, true );
footprint->TransformPadsWithClearanceToPolygon( *m_backPlatedPadPolys, B_Cu, 0, ARC_HIGH_DEF, ERROR_INSIDE, true, false, true ); } } }
// Add graphic item on copper layers to object containers
for( PCB_LAYER_ID curr_layer_id : layer_id ) { wxASSERT( m_layerMap.find( curr_layer_id ) != m_layerMap.end() );
BVH_CONTAINER_2D *layerContainer = m_layerMap[curr_layer_id];
// Add graphic items on copper layers (texts and other graphics)
for( BOARD_ITEM* item : m_board->Drawings() ) { if( !item->IsOnLayer( curr_layer_id ) ) continue;
switch( item->Type() ) { case PCB_SHAPE_T: addShapeWithClearance( static_cast<PCB_SHAPE*>( item ), layerContainer, curr_layer_id, 0 ); break;
case PCB_TEXT_T: addShapeWithClearance( static_cast<PCB_TEXT*>( item ), layerContainer, curr_layer_id, 0 ); break;
case PCB_DIM_ALIGNED_T: case PCB_DIM_CENTER_T: case PCB_DIM_RADIAL_T: case PCB_DIM_ORTHOGONAL_T: case PCB_DIM_LEADER_T: addShapeWithClearance( static_cast<PCB_DIMENSION_BASE*>( item ), layerContainer, curr_layer_id, 0 ); break;
default: wxLogTrace( m_logTrace, wxT( "createLayers: item type: %d not implemented" ), item->Type() ); break; } } }
// Add graphic item on copper layers to poly contours (vertical outlines)
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL ) { for( PCB_LAYER_ID cur_layer_id : layer_id ) { wxASSERT( m_layers_poly.find( cur_layer_id ) != m_layers_poly.end() );
SHAPE_POLY_SET *layerPoly = m_layers_poly[cur_layer_id];
// Add graphic items on copper layers (texts and other )
for( BOARD_ITEM* item : m_board->Drawings() ) { if( !item->IsOnLayer( cur_layer_id ) ) continue;
switch( item->Type() ) { case PCB_SHAPE_T: item->TransformShapeWithClearanceToPolygon( *layerPoly, cur_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); break;
case PCB_TEXT_T: { PCB_TEXT* text = static_cast<PCB_TEXT*>( item );
text->TransformTextShapeWithClearanceToPolygon( *layerPoly, cur_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); } break;
default: wxLogTrace( m_logTrace, wxT( "createLayers: item type: %d not implemented" ), item->Type() ); break; } } } }
if( m_Cfg->m_Render.show_zones ) { if( aStatusReporter ) aStatusReporter->Report( _( "Create zones" ) );
std::vector<std::pair<ZONE*, PCB_LAYER_ID>> zones; std::unordered_map<PCB_LAYER_ID, std::unique_ptr<std::mutex>> layer_lock;
for( ZONE* zone : m_board->Zones() ) { for( PCB_LAYER_ID layer : zone->GetLayerSet().Seq() ) { zones.emplace_back( std::make_pair( zone, layer ) ); layer_lock.emplace( layer, std::make_unique<std::mutex>() ); } }
// Add zones objects
std::atomic<size_t> nextZone( 0 ); std::atomic<size_t> threadsFinished( 0 );
size_t parallelThreadCount = std::min<size_t>( zones.size(), std::max<size_t>( std::thread::hardware_concurrency(), 2 ) );
for( size_t ii = 0; ii < parallelThreadCount; ++ii ) { std::thread t = std::thread( [&]() { for( size_t areaId = nextZone.fetch_add( 1 ); areaId < zones.size(); areaId = nextZone.fetch_add( 1 ) ) { ZONE* zone = zones[areaId].first;
if( zone == nullptr ) break;
PCB_LAYER_ID layer = zones[areaId].second;
auto layerContainer = m_layerMap.find( layer ); auto layerPolyContainer = m_layers_poly.find( layer );
if( layerContainer != m_layerMap.end() ) { addSolidAreasShapes( zone, layerContainer->second, layer ); }
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL && layerPolyContainer != m_layers_poly.end() ) { auto mut_it = layer_lock.find( layer );
std::lock_guard< std::mutex > lock( *( mut_it->second ) ); zone->TransformSolidAreasShapesToPolygon( layer, *layerPolyContainer->second ); } }
threadsFinished++; } );
t.detach(); }
while( threadsFinished < parallelThreadCount ) std::this_thread::sleep_for( std::chrono::milliseconds( 10 ) );
}
// Simplify layer polygons
if( aStatusReporter ) aStatusReporter->Report( _( "Simplifying copper layers polygons" ) );
if( m_Cfg->m_Render.opengl_copper_thickness && m_Cfg->m_Render.engine == RENDER_ENGINE::OPENGL ) { if( renderPlatedPadsAsPlated ) { if( m_frontPlatedPadPolys && ( m_layers_poly.find( F_Cu ) != m_layers_poly.end() ) ) { if( aStatusReporter ) aStatusReporter->Report( _( "Simplifying polygons on F_Cu" ) );
SHAPE_POLY_SET *layerPoly_F_Cu = m_layers_poly[F_Cu]; layerPoly_F_Cu->BooleanSubtract( *m_frontPlatedPadPolys, SHAPE_POLY_SET::PM_FAST );
m_frontPlatedPadPolys->Simplify( SHAPE_POLY_SET::PM_FAST ); }
if( m_backPlatedPadPolys && ( m_layers_poly.find( B_Cu ) != m_layers_poly.end() ) ) { if( aStatusReporter ) aStatusReporter->Report( _( "Simplifying polygons on B_Cu" ) );
SHAPE_POLY_SET *layerPoly_B_Cu = m_layers_poly[B_Cu]; layerPoly_B_Cu->BooleanSubtract( *m_backPlatedPadPolys, SHAPE_POLY_SET::PM_FAST );
m_backPlatedPadPolys->Simplify( SHAPE_POLY_SET::PM_FAST ); } }
std::vector< PCB_LAYER_ID > &selected_layer_id = layer_id; std::vector< PCB_LAYER_ID > layer_id_without_F_and_B;
if( renderPlatedPadsAsPlated ) { layer_id_without_F_and_B.clear(); layer_id_without_F_and_B.reserve( layer_id.size() );
for( size_t i = 0; i < layer_id.size(); ++i ) { if( ( layer_id[i] != F_Cu ) && ( layer_id[i] != B_Cu ) ) layer_id_without_F_and_B.push_back( layer_id[i] ); }
selected_layer_id = layer_id_without_F_and_B; }
if( selected_layer_id.size() > 0 ) { if( aStatusReporter ) { aStatusReporter->Report( wxString::Format( _( "Simplifying %d copper layers" ), (int) selected_layer_id.size() ) ); }
std::atomic<size_t> nextItem( 0 ); std::atomic<size_t> threadsFinished( 0 );
size_t parallelThreadCount = std::min<size_t>( std::max<size_t>( std::thread::hardware_concurrency(), 2 ), selected_layer_id.size() );
for( size_t ii = 0; ii < parallelThreadCount; ++ii ) { std::thread t = std::thread( [&nextItem, &threadsFinished, &selected_layer_id, this]() { for( size_t i = nextItem.fetch_add( 1 ); i < selected_layer_id.size(); i = nextItem.fetch_add( 1 ) ) { auto layerPoly = m_layers_poly.find( selected_layer_id[i] );
if( layerPoly != m_layers_poly.end() ) // This will make a union of all added contours
layerPoly->second->Simplify( SHAPE_POLY_SET::PM_FAST ); }
threadsFinished++; } );
t.detach(); }
while( threadsFinished < parallelThreadCount ) std::this_thread::sleep_for( std::chrono::milliseconds( 10 ) ); } }
// Simplify holes polygon contours
if( aStatusReporter ) aStatusReporter->Report( _( "Simplify holes contours" ) );
for( PCB_LAYER_ID layer : layer_id ) { if( m_layerHoleOdPolys.find( layer ) != m_layerHoleOdPolys.end() ) { // found
SHAPE_POLY_SET *polyLayer = m_layerHoleOdPolys[layer]; polyLayer->Simplify( SHAPE_POLY_SET::PM_FAST );
wxASSERT( m_layerHoleIdPolys.find( layer ) != m_layerHoleIdPolys.end() );
polyLayer = m_layerHoleIdPolys[layer]; polyLayer->Simplify( SHAPE_POLY_SET::PM_FAST ); } }
// End Build Copper layers
// This will make a union of all added contours
m_throughHoleOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST ); m_nonPlatedThroughHoleOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST ); m_throughHoleViaOdPolys.Simplify( SHAPE_POLY_SET::PM_FAST ); m_throughHoleAnnularRingPolys.Simplify( SHAPE_POLY_SET::PM_FAST );
// Build Tech layers
// Based on:
// https://github.com/KiCad/kicad-source-mirror/blob/master/3d-viewer/3d_draw.cpp#L1059
if( aStatusReporter ) aStatusReporter->Report( _( "Build Tech layers" ) );
// draw graphic items, on technical layers
static const PCB_LAYER_ID teckLayerList[] = { B_Adhes, F_Adhes, B_Paste, F_Paste, B_SilkS, F_SilkS, B_Mask, F_Mask,
// Aux Layers
Dwgs_User, Cmts_User, Eco1_User, Eco2_User, Edge_Cuts, Margin };
// User layers are not drawn here, only technical layers
for( LSEQ seq = LSET::AllNonCuMask().Seq( teckLayerList, arrayDim( teckLayerList ) ); seq; ++seq ) { const PCB_LAYER_ID curr_layer_id = *seq;
if( !Is3dLayerEnabled( curr_layer_id ) ) continue;
if( aStatusReporter ) aStatusReporter->Report( wxString::Format( _( "Build Tech layer %d" ), (int)curr_layer_id ) );
BVH_CONTAINER_2D *layerContainer = new BVH_CONTAINER_2D; m_layerMap[curr_layer_id] = layerContainer;
SHAPE_POLY_SET *layerPoly = new SHAPE_POLY_SET; m_layers_poly[curr_layer_id] = layerPoly;
// Add drawing objects
for( BOARD_ITEM* item : m_board->Drawings() ) { if( !item->IsOnLayer( curr_layer_id ) ) continue;
switch( item->Type() ) { case PCB_SHAPE_T: addShapeWithClearance( static_cast<PCB_SHAPE*>( item ), layerContainer, curr_layer_id, 0 ); break;
case PCB_TEXT_T: addShapeWithClearance( static_cast<PCB_TEXT*>( item ), layerContainer, curr_layer_id, 0 ); break;
case PCB_DIM_ALIGNED_T: case PCB_DIM_CENTER_T: case PCB_DIM_RADIAL_T: case PCB_DIM_ORTHOGONAL_T: case PCB_DIM_LEADER_T: addShapeWithClearance( static_cast<PCB_DIMENSION_BASE*>( item ), layerContainer, curr_layer_id, 0 ); break;
default: break; } }
// Add drawing contours
for( BOARD_ITEM* item : m_board->Drawings() ) { if( !item->IsOnLayer( curr_layer_id ) ) continue;
switch( item->Type() ) { case PCB_SHAPE_T: item->TransformShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); break;
case PCB_TEXT_T: { PCB_TEXT* text = static_cast<PCB_TEXT*>( item );
text->TransformTextShapeWithClearanceToPolygon( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); } break;
default: break; } }
// Add footprints tech layers - objects
for( FOOTPRINT* footprint : m_board->Footprints() ) { if( ( curr_layer_id == F_SilkS ) || ( curr_layer_id == B_SilkS ) ) { int linewidth = m_board->GetDesignSettings().m_LineThickness[ LAYER_CLASS_SILK ];
for( PAD* pad : footprint->Pads() ) { if( !pad->IsOnLayer( curr_layer_id ) ) continue;
buildPadOutlineAsSegments( pad, layerContainer, linewidth ); } } else { addPadsWithClearance( footprint, layerContainer, curr_layer_id, 0, false, false, false ); }
addFootprintShapesWithClearance( footprint, layerContainer, curr_layer_id, 0 ); }
// Add footprints tech layers - contours
for( FOOTPRINT* footprint : m_board->Footprints() ) { if( ( curr_layer_id == F_SilkS ) || ( curr_layer_id == B_SilkS ) ) { int linewidth = m_board->GetDesignSettings().m_LineThickness[ LAYER_CLASS_SILK ];
for( PAD* pad : footprint->Pads() ) { if( !pad->IsOnLayer( curr_layer_id ) ) continue;
buildPadOutlineAsPolygon( pad, *layerPoly, linewidth ); } } else { footprint->TransformPadsWithClearanceToPolygon( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE ); }
// On tech layers, use a poor circle approximation, only for texts (stroke font)
footprint->TransformFPTextWithClearanceToPolygonSet( *layerPoly, curr_layer_id, 0, ARC_HIGH_DEF, ERROR_INSIDE );
// Add the remaining things with dynamic seg count for circles
transformFPShapesToPolygon( footprint, curr_layer_id, *layerPoly ); }
// Draw non copper zones
if( m_Cfg->m_Render.show_zones ) { for( ZONE* zone : m_board->Zones() ) { if( zone->IsOnLayer( curr_layer_id ) ) addSolidAreasShapes( zone, layerContainer, curr_layer_id ); }
for( ZONE* zone : m_board->Zones() ) { if( zone->IsOnLayer( curr_layer_id ) ) zone->TransformSolidAreasShapesToPolygon( curr_layer_id, *layerPoly ); } }
// This will make a union of all added contours
layerPoly->Simplify( SHAPE_POLY_SET::PM_FAST ); } // End Build Tech layers
// Build BVH (Bounding volume hierarchy) for holes and vias
if( aStatusReporter ) aStatusReporter->Report( _( "Build BVH for holes and vias" ) );
m_throughHoleIds.BuildBVH(); m_throughHoleOds.BuildBVH(); m_throughHoleAnnularRings.BuildBVH();
if( !m_layerHoleMap.empty() ) { for( auto& hole : m_layerHoleMap ) hole.second->BuildBVH(); }
// We only need the Solder mask to initialize the BVH
// because..?
if( m_layerMap[B_Mask] ) m_layerMap[B_Mask]->BuildBVH();
if( m_layerMap[F_Mask] ) m_layerMap[F_Mask]->BuildBVH();}
|